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Healable resinsHealable Resins

CRG is currently developing a self-healing version of shape memory polymer (SMP) called Veriflex® EH. This healable SMP resin will enable increased survivability for manned and unmanned air vehicles, spacecraft, habitats for space exploration missions, automobiles, and more.

Veriflex EH is an epoxy-based resin that will be a direct replacement for current aerospace-grade epoxy resins. Veriflex EH can be processed using vacuum-assisted resin transfer molding (VARTM), RTM, or wet lay-up techniques. CRG is also developing a prepreg formulation.

Veriflex EH uses two healing mechanisms to restore up to 85% of original mechanical performance. The first healing mechanism, shape recovery, brings the cracked or damaged area back into intimate physical contact. The second healing mechanism, polymer diffusion, allows long polymer chains to diffuse across the failure line and restore mechanical integrity. Both healing mechanisms are thermally activated and are achieved in less than three minutes.

Possible Applications

   • Aerospace structures
   • Automobiles
   • Marine panels
   • Composite structures

Features and Benefits

   • 85% recovery of flexural strength
   • Lower cost maintenance and repair
   • Longer product life
   • Increased survivability
   • Tailorability for specific applications
   • Custom transition temperatures from 14°C to 105°C (57°F to 221°F)
   • Compatibility with standard processing and manufacturing (VARTM, filament
      winding, fiber placement)

Preliminary Data (material is still in development)

Property Values Method

Thermal      
  Glass Transition Temperature (Tg)
  DMA, Loss Modulus Peak
56°C 133°F DMA

Mechanical (at room temperature)      
  Tensile Strength 70.7 MPa 10 Kpsi ASTM D638
  Tensile Modulus 3030 MPa 439 Kpsi ASTM D638
  Tensile Elongation to Break 3.5%   ASTM D638
  Flexural Stress 119 MPa 17 psi ASTM D790
  Flexural Modulus 3590 MPa 520 psi ASTM D790

Mechanical (30°C/86°F above Tg)      
  Tensile Strength .242 MPa 35 psi ASTM D638
  Tensile Modulus .00066 MPa 96 psi ASTM D638
  Tensile Elongation to Break 268%   ASTM D638

Composite Mechanical (12-ply, 3k, plain weave carbon [0.90] 6)      
  Flexural Stress 490 MPa 71Kpsi ASTM D790
  Flexural Modulus 33000 MPa 4,786 Kpsi ASTM D790
  Flexural Stress (post-failure & healing)
  85% recovery of flexural modulus
417 MPa 61 Kpsi ASTM D790
  Flexural Modulus (post-failure &
  healing) 78% recovery of flexural
  modulus
26000 MPa 3,770 Kpsi ASTM D790
  Technology
Advanced Materials Portfolio:

  Advantic™
  All-Polymer Conductive
    Liquid Crystal Elastomer
  Cyanate Ester Elastomer
  Essemplex™ Thermoplastic
    Shape Memory Polymer
  Glassy Liquid Crystals
  Healable Resins
  Nanomaterials &
    Nanotechnology
  Next-Generation Custom
    Resins
  Polymer Formulation &
    Custom Resins
  Polymer Optics
  Self-Curing Composites
  Sialyte™ (inorganic resin)
  Verilyte™ (dynamic
    syntactic foam)
  Veriflex® (shape memory
    polymer)
  Veriflex® E (epoxy shape
    memory polymer)
  Veritex™ (shape memory
    composite)
Systems Engineering Portfolio
Manufacturing Technology Portfolio

Advanced Materials Overviews:
Shape Memory Polymers
Shape Memory Composites
Shape Memory Foams
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