Systems Engineering

The Systems Engineering Division combines electrical engineering, aerospace systems development, sensor/security platforms, and advanced materials implementation. These multi-disciplinary teams work together to create and develop game-changing technology solutions for customers’ real-world challenges.

Technology of the Day

Microscale Molding

Molding small, intricate parts in great detail has several challenges, such as retaining details and demolding without breaking the part. Veriflex®, CRG’s shape memory polymer, can aid in the molding process of small parts. A sheet of Veriflex and the original part are placed into a vacuum bag, heated above Veriflex’s activation temperature, and then cooled. The result is an exact negative of the original part, retaining all details, imprinted in the polymer. This mold can be used to form new microscale parts.

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