New Patent Issued for High-Temp SMP

On October 2, 1007, CRG was issued a patent for maleimide-based, high-temperature shape memory polymer. The patent (US Pat. No. 7,276,195) describes the use of maleimide-based SMP to form a mold for a product that requires high-temperature cure (above 100°C and preferably less than 150°C). The patent also discloses the range of chemical compositions for making such a mold. In addition, it describes the process of using that mold to aid the cured product in separating from the mold.

This patent is part of CRG's business model of creating an intellectual property landscape that benefits customers and increases their competitiveness in their field of use. (10-2-2007)