CRG Introduces Veriflex® E (Epoxy SMP)

CRG has developed a unique shape memory polymer (SMP) material, Veriflex E, with the versatile shape memory properties of styrene SMP, but with the toughness and strength of epoxy. Veriflex E is inherently tough and more convenient to process and use. It exhibits over 100% elongation with full recovery. Veriflex E can be tailored with a transition temperature ranging from 80° C to 130° C. One formulation has successfully passed out-gassing evaluation, making it viable for space-based applications.

CRG’s epoxy SMP is a high-performance material, providing the SMP properties of Veriflex with added toughness. Veriflex E is formulated from common resins and curing agents. Like the styrene version, it can be cast and cured into a variety of “memorized” shapes. Veriflex E has a very sharp storage modulus transition curve, indicating its quick recovery to the “memorized” shape when heated past its transition temperature. This illustrates the fast transition of the material between rigid and elastic states.

The SMP properties along with its ease of processing make Veriflex E an attractive material for many terrestrial, aerospace, and space-based applications. Suited for most composite processing methods, Veriflex E enables wider use and new applications for SMP materials. (3-30-2006)